|
WINDFORCE Cooling System Advanced Thermal Performance The WINDFORCE cooling system delivers exceptional thermal performance through a combination of cutting-edge technologies. It features server-grade thermal conductive gel, innovative Hawk fans with alternate spinning, composite copper heat pipes, a copper plate, 3D active fans, and screen cooling. HAWK Fan Technology The Hawk Fan features a unique blade design inspired by the aerodynamics of an eagle's wing. This design reduces air resistance and noise levels, resulting in up to a 53.6% increase in air pressure and a 12.5% increase in air volume without compromising acoustics. Graphene Nano Lubricant Graphene nano lubricant can extend the life of sleeve bearing fan by 2.1 times, close to the life of double ball bearing, and is quieter. Alternate Spinning Design Reduce the turbulence of adjacent fans and increase airflow pressure. 3D Active Fan The 3D Active Fan provides semi-passive cooling, and the fans will remain off when the GPU is in a low load or low power game. Server-Grade Thermal Conductive Gel To enhance product quality and reliability, we have introduced server-grade thermal conductive gel for cooling critical components such as VRAM and MOSFETs. This highly deformable, non-fluid gel provides optimal contact for uneven surface and effectively resists deformation from transport or long-term use, unlike traditional thermal pads. Copper Plate & Composite Copper Heat Pipe The copper plate directly contacts the GPU, coupled with the composite copper heat pipes, which quickly transfers the heat of the GPU and VRAM to the heatsink. Screen Cooling Extended heatsink allows air to pass through, providing better heat dissipation. Reinforced Structure The reinforced backplate securely fastened to the I/O bracket, provides exceptional structural integrity. Superior Craftsmanship Ultra Durable Components Ultra Cooling - Lower RDS(on) MOSFETs are specially designed to produce lower switching resistance for faster electric current charging and discharging at extremely low temperature. Low Power Loss - Metal Choke hold energy much longer than common iron-core chokes at high frequency, thus effectively reduce core energy loss and EMI interference. Longer Life - Lower ESR Solid Capacitors ensure better electronic conductivity for excellent system performance and longer lifespan. |
||||||||||||||||||||||||||||||||||||
Specification:
|
Description
Description
|
WINDFORCE Cooling System Advanced Thermal Performance The WINDFORCE cooling system delivers exceptional thermal performance through a combination of cutting-edge technologies. It features server-grade thermal conductive gel, innovative Hawk fans with alternate spinning, composite copper heat pipes, a copper plate, 3D active fans, and screen cooling. HAWK Fan Technology The Hawk Fan features a unique blade design inspired by the aerodynamics of an eagle's wing. This design reduces air resistance and noise levels, resulting in up to a 53.6% increase in air pressure and a 12.5% increase in air volume without compromising acoustics. Graphene Nano Lubricant Graphene nano lubricant can extend the life of sleeve bearing fan by 2.1 times, close to the life of double ball bearing, and is quieter. Alternate Spinning Design Reduce the turbulence of adjacent fans and increase airflow pressure. 3D Active Fan The 3D Active Fan provides semi-passive cooling, and the fans will remain off when the GPU is in a low load or low power game. Server-Grade Thermal Conductive Gel To enhance product quality and reliability, we have introduced server-grade thermal conductive gel for cooling critical components such as VRAM and MOSFETs. This highly deformable, non-fluid gel provides optimal contact for uneven surface and effectively resists deformation from transport or long-term use, unlike traditional thermal pads. Copper Plate & Composite Copper Heat Pipe The copper plate directly contacts the GPU, coupled with the composite copper heat pipes, which quickly transfers the heat of the GPU and VRAM to the heatsink. Screen Cooling Extended heatsink allows air to pass through, providing better heat dissipation. Reinforced Structure The reinforced backplate securely fastened to the I/O bracket, provides exceptional structural integrity. Superior Craftsmanship Ultra Durable Components Ultra Cooling - Lower RDS(on) MOSFETs are specially designed to produce lower switching resistance for faster electric current charging and discharging at extremely low temperature. Low Power Loss - Metal Choke hold energy much longer than common iron-core chokes at high frequency, thus effectively reduce core energy loss and EMI interference. Longer Life - Lower ESR Solid Capacitors ensure better electronic conductivity for excellent system performance and longer lifespan. |
||||||||||||||||||||||||||||||||||||
Specification:
|